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CMP WAFER CARRIER FOR PREFERENTIAL POLISHING OF A WAFER

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CMP WAFER CARRIER FOR PREFERENTIAL POLISHING OF A WAFER ( cmp-wafer-carrier-for-preferential-polishing-wafer )

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United States Patent (19) Desorcieetal. 54 CMP WAFER CARRIER FOR PREFERENTIAL POLISHING OF A WAFER 75 Inventors: DanielD.Desorcie,St.Albans; RichardJ.Lebel,Colchester;Charles A.McKinney,Chazy;RockNadeau -. . s Jericho;TimothyJ.Rickard,Jr., Milton;PaulH.Smith,Jr.,Essex Junction;DouglasK.Sturtevant,Essex Junction;MatthewT.Tiersch,Essex Junction,alofVt. 73 Assignee: InternationalBusinessMachines Corporation, Armonk, N.Y. 1 PatentNumber: 5,885,135 (45)DateofPatent: *Mar23,1999 5,036,630 8/1991 Kaantaetal. 5,127,196 7/1992 Morimotoetal..451/285 5,212,116 5/1993 Yu. 5,232,875 8/1993Tutleetal. 5,257.478 11/1993 Hydeetal. 5,394,655 3/1995Allenetal. 5,398.459 3/1995 Okumuraetal..451/286 5,423,716 6/195Strasbaugh. 5,476,414 12/1995 Hiroseetal..451/288 5,486,129 1/1996Sandhuetal. 5,533,924 7/1996Stroupeetal. 5,573,448 11/1996 Nakazimaetal..451/287 5,582,534 12/1996 Shendonetal..451/288 5,645,474 7/1997 Kuboetal..451/287 5.647,792 7/1997 Katsuokaetal..451/288 5,651,724 7/1997 Kimuraetal..451/285 * Notice: Thispatentissuedonacontinuedpros- PrimaryExaminer DavidA.Scherbel ecutionaplicationfiledunder37CFR AsistantExaminerDerisHoltBanks 1.53(d),andisSubjecttothetwentyyear Atorney,Agent,orFirmDeLio&Peterson,LLC;JohnJ. patenttermprovisionsof35U.S.C. 154(a)(2). 21 Appl.No.:842,129 22 Filed: Apr.23,1997 (51)Int.Cl..B24B1100 52 U.S.Cl..451/41;451/384;451/387 58 FieldofSearch.451/285–289, Tomaszewski;HowardJ.Walter,Jr. 57 ABSTRACT An apparatusforpolishingaSemiconductorwaferispro Videdwhichincludesawafercarierhavingonitslower Surfaceanon-uniformSurfaceStructuremeanstovarythe forceagainstawaferduringapolishingoperationSothatthe polishingisenhancedandimpartsaplanarSurfaceacroSSthe polishedwafer.Preferednon-uniformsurfacestructure meansincludeuseofawafercarierhavingonitslower Surfaceabackingfilmhavingafirstcentralportionhaving apredeterminedcompresibilityandaSecondperipheral portion having a diferent compressibility than the first portion. Another non-uniform Surface Structure means to varytheforceagainstthewafercomprisesawafercarier havingonitslowerSurfacearaisedcircumferentialregion aroundtheperipheryofthecarier. 17Claims,3DrawingSheets 56) ReferencesCited U.S. PATENT DOCUMENTS 451/41,364,379,384,385,388,390,397, 398,42,28 4,270,316 6/1981Krämeretal. 4,313.284 2/1982Walsh. 4,910,155 3/1990Coteetal. 4,918,869 4/1990Kita. 2 18 13 (ZZZZZZZZZZZ KS11 14 A 32-N- USOO58851.35A

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